Researchers from NITU MISIS developed a cost-efficient technology for the synthesis of heat-conducting polymer composites. Scientists used synthetic rubbers and silicon carbide as raw materials.
“After heat treatment, the material withstands temperatures of up to 300 °C, dissipates heat well and carries almost no current. In other words, it can be used in systems to remove heat from various electronic devices,” commented Andrei Stepashkin, one of the authors of the paper and senior researcher at NITU MISIS.
The material will solve one of the main problems of modern electronic chips and devices – overheating under high loads. Nowadays, designers of such chips use cooling systems – fans, radiators, pastes and adhesives that accelerate heat transfer.
Typically, heat-conducting metals such as copper and aluminium are used to make the components of such cooling systems. However, this is far from ideal due to the fact that metals conduct current, have a high density and are vulnerable to corrosion. This is why physicists, chemists and material scientists have been trying for many years to create insulating polymer materials that can conduct heat well and have no such disadvantages.